Etch Fine line is a high speed, moderate capacity, continuous alkaline etchant system used in the manufacture of fine line printed circuit boards. It will remove copper at an etch rate of 30 - 40 microns per minute at 45-52°C , and can dissolve and hold copper in solution in the range of 90 to 135 g/L.
This ammoniacal etchant shows excellent undercut characteristics for the production of very fine line circuitry commonly found on high density inner and outer layers of multilayer boards. Many types of resists can be used including gold, nickel, tin, tin-nickel and tin-lead. Due to this system's low pH capability (7.6-8.5), alkaline strippable inks and aqueous dry films have been used successfully.
Fresh Etch 50- PCB is a high speed, high copper capacity alkaline etchant solution used in the manufacture of printed circuit boards. It will remove copper at an etch rate of 30 - 50 microns per minute at 55°C. It can dissolve and hold copper in solution in the range of 150-180 g/L.
Etching Chemical solution are compatible with most common materials used in present etching equipment, such as PVC, PVDC, Titanium, Teflon, PVDF, CPVC ,PPC , PVDC - Molded glass and polypropylene .
|1. Ammonium Hydroxide||300 –400 g/l|
|2. SGP 100||200- 300 g/l|
|3. Specific gravity||1.010 – 1.035|
|4. pH@250C||9.5 – 9.75|
|6. Odour||Strong Ammonical odour|